Thin film transistor array panel and manufacturing method of the same

ABSTRACT

A thin film transistor (“TFT”) array panel includes; an insulation substrate, a TFT disposed on the insulation substrate and including a drain electrode, a passivation layer covering the TFT and including a contact portion disposed therein corresponding to the drain electrode, a partition comprising an organic material disposed on the passivation layer, and including a transverse portion, a longitudinal portion, and a contact portion disposed on the drain electrode, a color filter disposed on the passivation layer and disposed in a region defined by the partition, an organic capping layer disposed on the partition and the color filter, and a pixel electrode disposed on the organic capping layer, and connected to the drain electrode through the contact portion of the passivation layer and the contact portion of the partition, wherein a contact hole is formed in the organic capping layer corresponding to the contact portion of the passivation layer.

This application is a divisional of U.S. patent application Ser. No.12/414,932, filed on Mar. 31, 2009, which claims priority to KoreanPatent Application No. 10-2008-0083421, filed on Aug. 26, 2008, and allthe benefits accruing therefrom under 35 U.S.C. §119, the contents ofwhich in its entirety are herein incorporated by reference.

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention relates to a thin film transistor (“TFT”)substrate and a manufacturing method thereof.

(b) Description of the Related Art

A liquid crystal display (“LCD”) is one of the most commonly used flatpanel displays, and it includes two substrates with electrodes formedthereon and a liquid crystal layer interposed between the twosubstrates. In the LCD, a voltage is applied to the electrodes to alignliquid crystal molecules of the liquid crystal layer to thereby regulatethe transmittance of light passing through the liquid crystal layer.

Among the various types of LCDs, an LCD having a structure in whichfield generating electrodes are respectively formed on two displaypanels is widely used. Among the two display panels, a plurality ofpixel electrodes and thin film transistors (“TFTs”) are arranged in amatrix format on one display panel (hereinafter referred to as “a TFTarray panel”), and color filters of red, green, and blue are formed onthe other display panel and one common electrode covers the entiresurface of the other display panel (hereinafter referred to as “a commonelectrode panel”).

However, in this type of liquid crystal display, the pixel electrodesand the color filters are disposed on different display panels such thatit is difficult to align the pixel electrodes and the color filters toeach other, thereby generating an alignment error.

To solve this problem, a color filter on array (“CoA”) structure inwhich the pixel electrode and the color filter are formed on the samedisplay panel is provided. Here, a light blocking member is generallyformed on the same display panel as the pixel electrode as well as thecolor filter.

When forming the color filter on the same display panel as the pixelelectrode, the color filter is formed through an Inkjet printingprocess, thereby reducing the manufacturing time and cost by simplifyingthe manufacturing process. The light blocking member is formed as apartition in the Inkjet printing method.

However, the partition of the light blocking member has a low heightsuch that it is difficult to sufficiently divide the color filter formedby the Inkjet printing. Also, the partition of the light blocking memberis tapered, but the taper angle is small such that it is difficult tostably enclose the color filter.

In the color filter on array (“CoA”) structure, a contact hole forelectrically connecting the pixel electrode and the drain electrode isformed in the color filter, however the process is not easy. This isbecause the color filter or the black matrix between the pixel electrodeand the drain electrode must be removed, and the removal may involvemultiple precise steps.

BRIEF SUMMARY OF THE INVENTION

The present invention provides a method and apparatus to sufficientlyform a color filter by using a structure that does not include a lightblocking member when forming the color filter through Inkjet printing,and to easily form a contact hole exposing a drain electrode without aproblem of an electrical connection between the pixel electrode and thedrain electrode.

An exemplary embodiment of a thin film transistor array panel accordingto the present invention includes; an insulation substrate, a thin filmtransistor (“TFT”) disposed on the insulation substrate and including adrain electrode, a passivation layer covering the TFT and including acontact portion disposed therein corresponding to the drain electrode, apartition comprising a transparent organic material disposed on thepassivation layer, and including a transverse portion, a longitudinalportion, and a contact portion disposed on the drain electrode, a colorfilter disposed on the passivation layer and disposed in a regiondefined by the partition, an organic capping layer disposed on thepartition and the color filter, and a pixel electrode connected to thedrain electrode through the contact portion of the passivation layer andthe contact portion of the partition, wherein a contact hole is formedin the organic capping layer corresponding to the contact portion of thepassivation layer and the contact portion of the partition layer.

In one exemplary embodiment, the TFT array panel may further include alight blocking member disposed on the pixel electrode, and a spacercomprising substantially the same material as the light blocking memberdisposed on the pixel electrode and which has a top surface disposed ata greater distance from the insulation substrate than a top surface ofthe light blocking member.

In one exemplary embodiment, the light blocking member may include atransverse portion overlapping the transverse portion of the partition,and a longitudinal portion overlapping the longitudinal portion of thepartition.

In one exemplary embodiment, the longitudinal portion and the transverseportion of the light blocking member may be wider than the longitudinaland transverse portions of the partition, respectively.

In one exemplary embodiment, the light blocking member and the spacermay be integrally formed as a single unitary and indivisible unit, and aportion having a greatest distance from the insulation substratefunctions as a spacer.

In one exemplary embodiment, the partition may be disposed under thespacer.

In one exemplary embodiment, the partition may have a thickness of about2 μm to about 10 μm.

In one exemplary embodiment, the partition may be inclined with respectto the insulation substrate, and the inclination angle may be in therange of about 50° to about 120°.

In one exemplary embodiment, the transparent organic material for thepartition may include an organic material having a low dielectric ratioof less than about 4, or may be at least one selected from the groupconsisting of an interface surfactant, a silicon (Si) group, and afluorine (F) group.

In one exemplary embodiment, the TFT array panel may further include ametal pattern disposed under the passivation layer, and disposed on aregion corresponding to the contact portion of the partition.

In one exemplary embodiment, one pixel may include first and secondTFTs, the first TFT is connected to a gate line and a first data line,the second TFT is connected to the gate line and a second data line, andthe pixel electrode may include a first subpixel electrode connected tothe first TFT and a second subpixel electrode connected to the secondTFT.

In one exemplary embodiment, the first and second subpixel electrodesmay respectively include a slit pattern.

In one exemplary embodiment, the longitudinal portion of the partitionmay be formed with respect to a region between neighboring first datalines and second data lines, and overlaps the portion of the first dataline and the second data line.

In one exemplary embodiment, the transverse portion of the partition mayoverlap the gate lines.

An exemplary embodiment of a method for manufacturing a TFT array panelaccording to the present invention includes; disposing a TFT including adrain electrode on a substrate, disposing a passivation layer on the TFTand the substrate, depositing an transparent organic material on thepassivation layer and patterning the transparent organic material toform a partition including a transverse portion, a longitudinal portion,and a contact portion disposed on the drain electrode, forming a colorfilter in a region defined by the partition through an Inkjet printingmethod, depositing an organic capping layer covering the partition andthe color filter and removing a portion of the organic capping layeraligned with the drain electrode, removing a contact portion of thepartition and a portion of the passivation layer by a dry etch method toform a contact hole which exposes the drain electrode; and electricallyconnecting a pixel electrode to the drain electrode through the contacthole.

In one exemplary embodiment, the method may further include disposing alight blocking member overlapping the partition and disposing a spaceron the pixel electrode.

In one exemplary embodiment, the disposing of the light blocking memberand the disposing of the spacer includes; coating a photosensitiveresist on substantially the entire surface of the organic capping layerby dispersing black pigments, and patterning the photosensitive layerusing an exposure mask including a transparent region, a translucentregion, and a light blocking region through exposure and developing toform position dependent thicknesses.

In one exemplary embodiment, the formation of the partition may includecombining fluorine on the surface of the partition after the formationof the partition.

In one exemplary embodiment, the thickness of the partition may be in arange of about 2 μm to about 10 μm.

In one exemplary embodiment, the partition may be inclined with respectto the insulation substrate, and the inclination angle is in a range ofabout 50° to about 120°.

In one exemplary embodiment, the transverse and longitudinal portions ofthe partition may overlap at least a portion of a data line and a gateline connected to the TFT.

According to an exemplary embodiment of the present invention, thepartition made of an organic layer extends from the substrate asignificant distance, and the color filter is formed through an Inkjetprocess such that the color impression may be improved, mixing of colorsof neighboring color filters may be prevented, and the contact holeexposing the drain electrode may be easily formed. Further, in someexemplary embodiments additional elements do not exist on thecorresponding substrate besides the common electrode such that themanufacturing process of the corresponding substrate may be simplified,and a misalignment between two substrates is small.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an equivalent circuit diagram of an exemplary embodiment ofone pixel of an exemplary embodiment of a liquid crystal display (“LCD”)according to the present invention.

FIG. 2 is a top plan view of an exemplary embodiment of a thin filmtransistor (“TFT”) array panel according to the present invention.

FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2.

FIG. 4 to FIG. 8 are cross-sectional views sequentially illustrating anexemplary embodiment of the manufacturing process of the exemplaryembodiment of a TFT array panel shown in FIG. 3, taken along lineIII-III of FIG. 2.

FIG. 9 is a top plan view of a formation position of an exemplaryembodiment of a light blocking member in a TFT array panel according tothe present invention.

FIG. 10 is a cross-sectional view of the exemplary embodiment of aspacer and the light blocking member shown in FIG. 9.

FIG. 11 is a cross-sectional view of another exemplary embodiment of aTFT array panel according to the present invention.

FIG. 12 is a cross-sectional view of another exemplary embodiment of aTFT array panel according to the present invention, and shows the outerportion of the display panel.

FIG. 13 is a view illustrating a cross-sectional profile of a partitionwhen forming the partition using a light blocking member.

FIG. 14 is a view illustrating a cross-sectional profile of a partitionwhen forming the partition using an organic material according to anexemplary embodiment of the present invention.

FIG. 15 is a diagram illustrating differences according to taper angleand a filling effect thereof.

FIG. 16 is a table comparing a number of drops in consideration of colorreproducibility and a number of drops for a formation margin of a colorfilter when using a light blocking member as a partition.

FIG. 17 is a table comparing a number of drops in consideration of colorreproducibility and a number of drops for a formation margin of a colorfilter when using an organic layer of about 3.5 μm as a partition.

FIG. 18 is a table comparing a number of drops in consideration of colorreproducibility and a number of drops for a formation margin of a colorfilter when using an organic layer of about 2 μm as a partition.

FIG. 19 is a photograph illustrating inconsistencies generated in anouter portion of a pixel area when using a light blocking member as apartition.

FIG. 20 is a photograph illustrating a lack of inconsistencies in anouter portion of a pixel area when using an organic material as apartition.

DETAILED DESCRIPTION OF THE INVENTION

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which exemplary embodimentsof the invention are shown. This invention may, however, be embodied inmany different forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the invention to those skilled in the art. Likereference numerals refer to like elements throughout.

It will be understood that when an element is referred to as being “on”another element, it can be directly on the other element or interveningelements may be present therebetween. In contrast, when an element isreferred to as being “directly on” another element, there are nointervening elements present. As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another element, component, region, layer or section. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of the present invention.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother elements as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower”, can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments of the present invention are described herein withreference to cross section illustrations that are schematicillustrations of idealized embodiments of the present invention. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments of the present invention should not beconstrued as limited to the particular shapes of regions illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present invention.

Hereinafter, the present invention will be described in detail withreference to the accompanying drawings.

FIG. 1 is an equivalent circuit diagram of an exemplary embodiment ofone pixel in an exemplary embodiment of a liquid crystal display (“LCD”)according to the present invention.

Referring to FIG. 1, an exemplary embodiment of an LCD (“LCD”) accordingto the present invention includes signal lines including a plurality ofgate lines GL, a plurality of pairs of data lines DLa and DLb, and aplurality of storage electrode lines SL, and a plurality of pixels PXconnected to the signal lines. From a structural point of view, the LCDincludes a lower panel 100 and an upper panel 200 facing each other, anda liquid crystal layer 3 interposed therebetween.

Each pixel PX includes a pair of subpixels PXa and PXb. Each subpixelPXa/PXb includes a switching element Qa/Qb, a liquid crystal capacitorClca/Clcb, and a storage capacitor Csta/Cstb.

Each switching element Qa/Qb is a three-terminal element such as a thinfilm transistor (“TFT”) provided on the lower panel 100, and includes acontrol terminal connected to the gate line GL, an input terminalconnected to the data line DLa/DLb, and an output terminal connected tothe liquid crystal capacitor Clca/Clcb and the storage capacitorCsta/Cstb.

The liquid crystal capacitor Clca/Clcb uses a subpixel electrode 191a/191 b and a common electrode 270 as two terminals thereof. The liquidcrystal layer 3 between electrodes 191 a/191 b and 270 functions as adielectric material.

The storage capacitor Csta/Cstb serving as an assistant to the liquidcrystal capacitor Clca/Clcb is formed as a storage electrode line SLprovided on the lower display panel 100 and a subpixel electrode 191a/191 b overlaps with an insulator interposed therebetween, and apredetermined voltage such as the common voltage Vcom is appliedthereto.

A predetermined voltage difference is applied to the two liquid crystalcapacitors Clca and Clcb. For example, the data voltage applied to theliquid crystal capacitor Clca is less or more than the data voltageapplied to the liquid crystal capacitor Clcb. Therefore, when thevoltages of the first and second liquid crystal capacitors Clca and Clcbare appropriately adjusted, it is possible to make an image viewed fromthe side be as similar as possible to an image viewed from the front,and as a result it is possible to improve the side visibility of thedisplay.

Next, an exemplary embodiment of a TFT array panel according to thepresent invention will be described in detail with reference to FIG. 2and FIG. 3.

FIG. 2 is a top plan view of an exemplary embodiment of a TFT arraypanel according to the present invention, and FIG. 3 is across-sectional view of the exemplary embodiment of a TFT array panelshown in FIG. 2 taken along line III-III.

A plurality of gate lines 121 and a plurality of storage electrode lines131 and 135 are formed on an insulating substrate 110.

The gate lines 121 transmit gate signals and extend in the substantiallytransverse direction. Each gate line 121 includes a plurality of firstand second gate electrodes 124 a and 124 b protruding upward therefrom.

In the present exemplary embodiment, the storage electrode lines includea stem 131 extending substantially parallel to the gate lines 121, and aplurality of storage electrodes 135 branching from the stem 131.However, alternative exemplary embodiments include configurationswherein the shapes and arrangements of the storage electrode lines 131and 135 may be modified in various forms.

A gate insulating layer 140 is formed on the gate lines 121 and thestorage electrode lines 131 and 135, and a plurality of semiconductors154 a and 154 b, exemplary embodiments of which may be made of amorphousor crystallized silicon, are formed on the gate insulating layer 140.

A pair of a plurality of ohmic contacts may be formed on the firstsemiconductors 154 a and 154 b, and exemplary embodiments of the ohmiccontacts may be formed of a material such as n+ hydrogenated amorphoussilicon in which an n-type impurity is doped with a high concentration,or of silicide.

A plurality of pairs of data lines 171 a and 171 b and a plurality offirst and second drain electrodes 175 a and 175 b are formed on theohmic contacts and on the gate insulating layer 140.

The data lines 171 a and 171 b transmit data signals, extend in thesubstantially longitudinal direction, and are disposed substantiallyperpendicular to the gate lines 121 and the stems of the storageelectrode lines 131. Each data line 171 a/171 b includes a plurality offirst/second source electrodes 173 a/173 b extending toward thefirst/second gate electrodes 124 a/124 b and curved with a “U” shape,and the first/second source electrodes 173 a/173 b are opposite to thefirst/second drain electrodes 175 a/175 b with respect to thefirst/second gate electrodes 124 a/124 b, respectively.

Each of the first and second drain electrodes 175 a and 175 b startsfrom one end, which is enclosed by the first source electrode 173 a, andextends upward, and exemplary embodiments of the other end of the firstand second drain electrodes 175 a and 175 b may have a wide area forconnection with another layer.

However, above described exemplary embodiments of the shapes andarrangement of the first and second drain electrodes 175 a and 175 b andthe data lines 171 a and 171 b may be modified in various forms.

A first/second gate electrode 124 a/124 b, a first/second sourceelectrode 173 a/173 b, a first/second drain electrode 175 a/175 b, alongwith a first/second semiconductor 154 a/154 b respectively form afirst/second TFT Qa/Qb, and a channel of the first/second TFT Qa/Qb isformed on the first/second semiconductor 154 a/154 b between thefirst/second source electrode 173 a/173 b and the first/second drainelectrode 175 a/175 b.

The ohmic contacts are interposed only between the underlyingsemiconductor islands 154 a and 154 b, and the overlying data lines 171a and 171 b and drain electrodes 175 a and 175 b, and reduce contactresistance therebetween. The semiconductors 154 a and 154 b have aportion that is exposed without being covered by the data lines 171 aand 171 b and the drain electrodes 175 a and 175 b, and a portionbetween the source electrodes 173 a and 173 b and the drain electrodes175 a and 175 b.

In the present exemplary embodiment, the ohmic contacts, the data lines171 a, 171 b, 173 a, and 173 b, and the drain electrodes 175 a and 175 bhave the same shape as seen from a top plan view, and have substantiallythe same plane shape as the semiconductors 154 a and 154 b except forthe exposed portion between the drain electrodes 175 a and 175 b andsource electrodes 173 a and 173 b.

A passivation layer 180, exemplary embodiments of which may be made ofsilicon nitride or silicon oxide, is formed on the data lines 171 a and171 b, the drain electrodes 175 a and 175 b, and the exposed portions ofthe semiconductors 154 a and 154 b.

A partition 215, exemplary embodiments of which may be made of anorganic material, is formed on the passivation layer 180, and a colorfilter 230G, exemplary embodiments of which may be formed by Inkjetprinting, is formed in the region defined by the partition 215.

Firstly, the partition 215 includes a transverse portion substantiallyparallel to the gate line 121 and a longitudinal portion substantiallyparallel to the two neighboring data lines 171 a and 171 b and theregion therebetween, and a contact portion formed on the position wherea pixel electrode and a drain electrode are connected to each other, andit defines a region where the color filter will be formed. Exemplaryembodiments of the organic material for the partition 215 include a lowdielectric organic material having a dielectric ratio of less than about4. Also, the thickness of the partition 215 is in the range of about 2μm to about 10 μm, and is inclined at an inclination angle of about 50°to about 120° with respect to the substrate 110. Here, when the angle ismore than about 90°, it is referred to as a reverse taper structure.

The color filters 230R, 230G, and 230B are formed in the region wherethe partition 215 is not formed. In the present exemplary embodiment,the height of the partition 215 is high and the taper angle is largesuch that the color filters 230R, 230G, and 230B are stably anduniformly filled.

An organic capping layer 225 is formed on the partition 215 and thecolor filters 230R, 230G, and 230B. Exemplary embodiments of the organiccapping layer 225 may be made of an organic material havingphotosensitivity, and the dielectric ratio thereof is less than about 4.The organic capping layer 225 prevents the color filter 230 from beinglifted from the substrate 110 and suppresses contamination of the liquidcrystal layer 3 by an organic material such as a solvent flowing fromthe color filter 230G, and thereby problems such as an afterimage thatmay be generated during driving of the LCD may be prevented.

The passivation layer 180, the partition 215, and the organic cappinglayer 225 have contact holes 185 a and 185 b exposing the drainelectrodes 175 a and 175 b.

A plurality of pixel electrodes 191 are formed on the organic cappinglayer 225.

Each pixel electrode 191 includes the first and second subpixelelectrodes 191 a and 191 b that are separated from each other with a gap91 therebetween.

In the present exemplary embodiment, the overall shape of the pixelelectrode 191 is a quadrangle, and it includes a cross-shaped stemhaving a transverse stem and a longitudinal stem which intersect. Thepixel electrode 191 is divided into four sub-regions by the transversestem and the longitudinal stem, and each of the sub-regions include aplurality of minute branches.

One set of the minute branches obliquely extends from the transversestem or the longitudinal stem in the upper-left direction, and anotherset obliquely extends from the transverse stem or the longitudinal stemin the upper-right direction. Also, a further set obliquely extends fromthe transverse stem or the longitudinal stem in the lower-leftdirection, and the final set obliquely extends from the transverse stemor the longitudinal stem in the lower-right direction.

In the present exemplary embodiment, the minute branches form an angleof about 45 degrees or about 135 degrees with the gate lines 121. Also,the minute branches of two neighboring sub-regions may be substantiallyperpendicular to one another.

Although not shown, exemplary embodiments include configurations whereinthe width of the minute branches may become wider close to thetransverse stem or the longitudinal stem.

In one exemplary embodiment, the area occupied by the second subpixelelectrode 191 b may be larger than the area occupied by the firstsubpixel electrode 191 a in the whole pixel electrode 191, and in suchan exemplary embodiment, the basic electrodes 191 may be formeddifferently from each other to have the area of the second subpixelelectrode 191 b have about 1.0 to about 2.2 times the area of the firstsubpixel electrode 191 a. However, the shape and the area ratio of thefirst and second subpixel electrodes 191 a and 191 b may be variouslychanged.

Each first/second subpixel electrode 191 a/191 b is physically andelectrically connected to the first/second drain electrode 175 a/175 bthrough the contact hole 185 a/185 b, and receives data voltages fromthe first/second drain electrode 175 a/175 b, respectively.

The pattern of the pixel electrode 191 as seen from a top plan view maybe formed with various patterns. In the present exemplary embodiment,the pixel electrode 191 includes the first and second subpixelelectrodes 191 a and 191 b, and the first and second subpixel electrodes191 a and 191 b are respectively connected to the first and second drainelectrodes 175 a and 175 b, however, in another exemplary embodiment,the pixel electrode 191 may be made of a single electrode and may beconnected to one drain electrode.

Although not shown, a LCD including the exemplary embodiment of a TFTarray panel according to the present invention includes an upper panel(not shown) facing the TFT array panel.

The upper panel may include a common electrode (not shown) formed on aninsulation substrate, and an alignment layer (not shown) formed thereon.

Polarizers (not shown) may be provided on the outer surfaces of the TFTarray panel and the common electrode panel.

A liquid crystal layer (not shown) is interposed between the TFT arraypanel and the common electrode panel.

The above-described TFT array panel for the LCD will now be describedwith reference to FIG. 4 to FIG. 8 as well as FIG. 2 and FIG. 3.

FIG. 4 to FIG. 8 are cross-sectional views sequentially showing anexemplary embodiment of the manufacturing process of the exemplaryembodiment of a TFT array panel shown in FIG. 3, and taken along lineIII-III of FIG. 2.

In FIG. 4, although the gate line and the portion of the layeredstructure are not shown for ease of description, they may be formed withthe same method as a general manufacturing method of the TFT array panelfor the LCD, e.g., chemical vapor deposition (“CVD”), etc. The structureshown in FIG. 4 represents a point where the passivation layer 180 isformed, and it will be described as follows.

A gate line 121 including gate electrodes 124 a and 124 b is formed onan insulation substrate 110, a gate insulating layer is formed on thesubstrate 110 including the gate line 121, and an amorphous siliconlayer which is not doped with an impurity, an amorphous silicon layerwhich is doped with an impurity, and a data conductive layer aresequentially deposited. Next, a photosensitive film (not shown) iscoated on the data conductive layer and developed using a slit mask toform a photoresist pattern having different thicknesses depending onposition. Next, the data conductive layer, the intrinsic amorphoussilicon layer, and the extrinsic amorphous silicon layer are firstlyetched using the photoresist pattern as a mask to form semiconductors154 a and 154 b, and then the data conductive layer is secondly etchedto form data lines 171 a and 171 b including source electrodes 173 a and173 b, and drain electrodes 175 a and 175 b.

Next, the exposed amorphous silicon layer is removed using the sourceelectrodes 173 a and 173 b and the drain electrodes 175 a and 175 b as amask to form ohmic contact layers. Next, a passivation layer 180 isformed on the data lines 171 a and 171 b, the drain electrodes 175 a and175 b, and the gate insulating layer 140.

Next, as shown in FIG. 5, a partition 215 made of the organic materialis formed with a thickness of about 2 μm to about 10 μm on thepassivation layer 180. The partition 215 is formed to overlap theportion of the data lines 171 a and 171 b on both sides with respect tothe center between two neighboring data lines 171 a and 171 b and thegate line 121, thereby enclosing one pixel area. Also, the partition 215is formed on the position where the drain electrodes 175 a and 175 b andthe pixel electrode are connected to each other. In the presentexemplary embodiment, the organic material is a low dielectric ratioorganic material having a dielectric ratio of less than about 4, and theside walls thereof are inclined with respect to the surface to thesubstrate 110 with an inclination angle in a range of about 50° to about120°. Here, an angle of more than 90° indicates a reverse taperstructure.

Exemplary embodiments of the organic material used to form the partition215 may include an interface surfactant and at least one materialselected from a silicon (Si) group and a fluorine (F) group, and thefluorine is combined to the surface of the partition 215 and a surfacetreatment may be executed thereto to improve the surface characteristicsof the partition 215 after forming the partition 215.

Color filters 230R, 230G, and 230B are formed through an Inkjet printingprocess, as shown in FIG. 6. The partition 215 is tapered, and theheight thereof is high such that the color filters 230R, 230G, and 230Bare stably formed in the partition. This will be described below withrespect to FIG. 13.

Next, as shown in FIG. 7, an organic capping layer 225 is formed on thepartition 215 and the color filters 230R, 230G, and 230B and patteredthrough an exposure and developing process to form an opening 185-1 onthe portion corresponding to the drain electrodes 175 a and 175 b.

Next, as shown in FIG. 8, the partition 215 and the passivation layer180 at the region where the organic capping layer 225 is opened areremoved through a dry etch method to form contact holes 185.

When the exemplary embodiment of a TFT array panel according to thepresent invention is formed, a light blocking member to additionallyblock the light is also formed, and the light blocking member will bedescribed with reference to FIG. 9 and FIG. 10.

FIG. 9 is a top plan view of a formation position of a light blockingmember in an exemplary embodiment of a TFT array panel according to thepresent invention, and FIG. 10 is a cross-sectional view of the spacerand the light blocking member shown in FIG. 9.

According to FIG. 9 and FIG. 10, the light blocking member 220 includesa longitudinal portion formed in the longitudinal directionsubstantially parallel to two neighboring data lines 171 a and 171 b andformed in the region therebetween, and a transverse portion extendingfrom the longitudinal portion substantially parallel to the gate line121. Here, the longitudinal and transverse portions of the lightblocking member 220 overlap the longitudinal and transverse portions ofthe partition 215, and in one exemplary embodiment the width of thelongitudinal and transverse portions of the light blocking member 220may be wider than the longitudinal and transverse portions of thepartition 215. Also, the light blocking member 220 may be formed on theregion of the contact portion of the partition 215. Furthermore, whenforming the light blocking member 220, a spacer 235 may besimultaneously formed. According to one exemplary embodiment, the spacer235 may be made of substantially the same material as the light blockingmember 220 such that the spacer 235 blocks the light, and the spacer 235has a higher height than the light blocking member 220 such that itfunctions to uniformly maintain an interval between the upper substrateand the lower substrate.

To form the light blocking member 220 and the spacer 235, aphotosensitive resist dispersed with black pigments is coated on thesubstrate, and is exposed and developed using an exposure mask having atransparent region, a translucent region, and a light blocking regionfor the black photosensitive resist to have the different thicknessesdepending on position. A slit pattern, a lattice pattern, or a thin filmhaving medium transmittance or medium thickness is provided on thetranslucent region.

According to an exemplary embodiment of the present invention the spaceris disposed on the gate line 121, and is spaced away from twoneighboring light blocking members 220 by the predetermined distance.Alternative exemplary embodiments than that shown in FIG. 9 and FIG. 10,include configurations wherein the position of the spacer 235 may benon-specific, and may be formed on the outer area of the substrate aswell as on the data line and the gate line.

FIG. 11 is a cross-sectional view of another exemplary embodiment of aTFT array panel according to of the present invention.

FIG. 11 is as a cross-sectional view corresponding to FIG. 6, and a gatemetal pattern 125 b is added thereto in contrast to FIG. 6.

The gate metal pattern 125 b is formed with substantially the samematerial as the gate line 121, and is electrically separated from thegate line 121 and the gate electrodes 124 a and 124 b. Also, the gatemetal pattern 125 b is disposed under the contact portion of thepartition 215, that is, the portion where the pixel electrode and thedrain electrode are electrically connected to each other. The gate metalpattern 125 b reduces the thickness of the partition 215 that is removedthrough the exposure and developing such that the drain electrode may beeasily exposed. That is, the thickness of the passivation layer 180 thatis etched by the dry etch method is the same, however the thickness ofthe partition 215 is reduced such that the time for the exposure anddeveloping to create a contact hole therethrough is reduced. Incomparison to FIG. 6, where the thickness of the partition 215 to beetched to expose the passivation layer 180 is about 1.3 μm, for example,the gate metal pattern 125 b of FIG. 11 with a thickness of about 0.4 μmreduces the thickness of the partition 215 to be etched to about 0.9 μm.According to an exemplary embodiment, the gate metal pattern 125 b maybe formed with a different layer from that of the gate line 121, howeverexemplary embodiments include configurations wherein the gate metalpattern 125 b is disposed under the passivation layer 180.

FIG. 12 is a cross-sectional view of another exemplary embodiment of aTFT array panel according to the present invention, and shows an outerportion of the display panel.

FIG. 12 is a cross-sectional view corresponding to FIG. 10, and whenforming the light blocking member 220 and the spacer 235, an outer lightblocking member 226 made of a material to block the light is formed onthe outer area of the display substrate, and the outer light blockingmember 226 may have a different height from that of the light blockingmember 220 of the display area. Also, the outer light blocking member226 may have more than two high points, and the portion of the highestheight among them may have the function of an outer spacer 227supporting the interval between the upper and lower substrates.

The outer spacer 227 is shown to maintain the interval between the upperand lower substrates while contacting with the upper substrate.

In one exemplary embodiment, the light blocking member 220, the spacer235, the outer light blocking member 226, and the outer spacer 227 areall formed through one exposure and developing process using a singlemask. The mask includes a translucent region or a slit pattern, andcontrols the exposure amount to control the height of each pattern.

In one exemplary embodiment, the portion covered by the outer lightblocking member 226 corresponds to a driving circuit integrated on thesubstrate.

Next, a characteristic improvement due to the present invention will bedescribed. Firstly, the taper structure will be described.

FIG. 13 is a view illustrating a cross-sectional profile of a partitionwhen forming the partition using a light blocking member, FIG. 14 is aview illustrating a cross-sectional profile of a partition when formingthe partition using an organic material according to an exemplaryembodiment of the present invention, and FIG. 15 is a diagramillustrating the difference according to a taper angle and a fillingeffect thereof.

Firstly, as shown in FIG. 13, when a partition is formed using a lightblocking member partition, it may be confirmed that the height is lowand the taper angle is small. The light is blocked using a material forthe light blocking member such as copper black. However, when thematerial is formed thickly, it is difficult to pattern it such that thethickness may not be greater than a predetermined amount. Also, there isa characteristic that the taper angle is small after the etchingprocess.

In contrast, in the exemplary embodiment when the partition is formedusing the organic material as shown in FIG. 14, the height of thepartition may be high. The height is shown as about 4.77 μm in FIG. 14,but the height thereof may be greater than this value. Also, the sidesurface of the partition has the taper structure and the taper angle islarge. FIG. 14 shows the exemplary embodiment having an angle that isclose to about 90 degrees. The organic material is easily etched suchthat there are merits that a thick structure may be etched quickly andmay retain the large taper angle.

FIG. 15 is a diagram illustrating differences according to taper angleand a filling effect thereof. That is, when a partition having a smallangle as in FIG. 13 is formed using the light blocking member and thecolor filter is formed through Inkjet printing, a capillary force aresmaller at the corresponding corner region compared with that of FIG. 14such that the color filter is not easily filled. This effect is similarto that when a capillary tube having a small radius is used and a columnof the water may be more highly raised as compared to a thicker columnof water, and the capillary force may be calculated by the formulabelow.

Capillary force=surface tension*curvature  (Equation 1)

That is, the capillary force is proportional to the curvature, and whenthe curvature is large the color filter is uniformly formed in thecorner, as in the case of FIG. 14, whereas if the curvature is small,the color filter material will tend to not fill the entire area betweenadjacent light blocking members 220.

Next, the margin related to color reproducibility will be described.

For displaying a predetermined position on the color coordinate throughthe color filter in the LCD, the volume of the color filter across theplurality of pixels must be controlled in consideration of the colorreproducibility of each color. The volume of the color filter iscontrolled through the amount of drops dispersed by Inkjet printing inthe Inkjet printing method.

FIG. 16 is a table comparing a number of drops in consideration of colorreproducibility and a number of drops for a formation margin of a colorfilter when using a light blocking member as a partition, FIG. 17 is atable comparing a number of drops in consideration of colorreproducibility and a number of drops for a formation margin of a colorfilter when using an organic layer of about 3.5 μm as a partitionaccording to the present exemplary embodiment, and FIG. 18 is a tablecomparing a number of drops in consideration of color reproducibilityand a number of drops for a formation margin of a color filter whenusing an organic layer of about 2 μm as a partition according to thepresent exemplary embodiment.

Firstly, FIG. 16 will be described. In the case of the red color filter,35 drops of ink do not normally fill the pixel area and 83 dropsoverflows the partition into a neighboring pixel, such that anappropriate number of drops is from about 38 to about 80. Here, therequired number of red drops in consideration of color reproducibilityis 70 drops such that it may be confirmed that the red color filter maybe formed within the margin range.

However, the margins of the green and blue color filters are smallerthan that of the red color filter. That is, the margin range is from 43drops to 68 drops in the case of the green, but the required number ofdrops in consideration of green color reproducibility is 68 drops, whichis equal to the upper level of the margin. Also, in the case of theblue, the required number of drops is equal to the upper level of themargin, i.e., 68 drops. As a result, the LCD may be manufactured, butthe potential for deteriorations (a color filter overflowing into aneighboring pixel) due to process errors may be generated.

In contrast, it may be confirmed that there are sufficient marginswithin the manufacturing process with reference to FIG. 17 and FIG. 18.Firstly, the exemplary embodiment of a partition made of an organiclayer with a thickness of about 3.5 μm of FIG. 17 will be described.

It may be confirmed that the margin range of the red color filter isfrom 10 drops to 120 drops, the margin range of the green color filteris from 13 drops to 105 drops, and the margin range of the blue colorfilter is from 13 drops to 105 drops. Also, since the required numberfor each of the color filters is 68 drops, the margin range issufficiently large such that the deteriorations are not generated. Forinstance, none of the required number of drops is on the boundary of theprocess margins as in the previously described configuration.

An exemplary embodiment of a partition made of an organic layer with athickness of about 2 μm of FIG. 18 will now be described.

It may be confirmed that the margin range of the red color filter isfrom 13 drops to 100 drops, the margin range of the green color filteris from 18 drops to 98 drops, and the margin range of the blue colorfilter is from 13 drops 103 drops. Given that the required number ofdrops of each color filter is 68 drops, it is confirmed that the marginrange is sufficiently large. While the margin range is smaller than thatof FIG. 17, the margin range is sufficient such that the deteriorationsare not generated.

Differently from what is described above, when the light blocking memberis used as the partition, the problems stated below may be generated andthe organic partition is used to alleviate these problems.

FIG. 19 is a photograph illustrating inconsistencies that are generatedin an outer portion of a pixel area when using a light blocking memberas a partition, and FIG. 20 is a photograph illustrating a lack ofinconsistencies in an outer portion of a pixel area when using anorganic material as a partition.

As shown in FIG. 19, the color filter is not uniformly filled due to theside profile of the partition of the light blocking member, and as aresult a region on the circumference of the pixel area does notuniformly display the color of the color filter, (in FIG. 19,particularly the blue pixel is easily visible) such that the displayquality is deteriorated.

In contrast, referring to FIG. 20, when the partition is made of theorganic material, the side profile of the partition is good such thatthe color filter is stably and uniformly filled, and as a result thecolor impression is not deteriorated at the circumference of the pixelarea.

In FIG. 2 to FIG. 8, the structure of the exemplary embodiment of a TFTarray panel according to the present invention was described, but thepresent invention is not limited thereto. Particularly, in FIG. 2 toFIG. 8, one pixel includes two data lines, two TFTs, and two subpixelelectrodes, but the present invention is not limited thereto. Also, thepartitions 215 are individually disposed in FIG. 2 to FIG. 8, but thepresent invention is not limited thereto.

An organic material for the partition 215 may be a transparent organicmaterial.

While this invention has been described in connection with what ispresently considered to be practical exemplary embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

What is claimed is:
 1. A method for manufacturing a thin film transistorarray panel, comprising: disposing a thin film transistor including adrain electrode on a substrate; disposing a passivation layer on thethin film transistor and the substrate; depositing an transparentorganic material on the passivation layer and patterning the transparentorganic material to form a partition including a transverse portion, alongitudinal portion, and a contact portion disposed on the drainelectrode; forming a color filter in a region defined by the partitionthrough an Inkjet printing method; depositing an organic capping layercovering the partition and the color filter; removing a portion of theorganic capping layer aligned with the drain electrode; removing acontact portion of the partition and a portion of the passivation layerby a dry etch method to form a contact hole which exposes the drainelectrode; and electrically connecting a pixel electrode to the drainelectrode through the contact hole.
 2. The method of claim 1, furthercomprising: disposing a light blocking member overlapping the partition;and disposing a spacer on the pixel electrode.
 3. The method of claim 2,wherein, the disposing of the light blocking member and the disposing ofthe spacer, comprises: coating a photosensitive resist on substantiallythe entire surface of the organic capping layer by dispersing blackpigments; and patterning the photosensitive layer using an exposure maskincluding a transparent region, a translucent region, and a lightblocking region through exposure and developing to form positiondependent thicknesses.
 4. The method of claim 1, wherein the formationof the partition includes combining fluorine on the surface of thepartition after the formation of the partition.
 5. The method of claim1, wherein the thickness of the partition is in a range of about 2 μm toabout 10 μm.
 6. The method of claim 1, wherein the partition is inclinedwith respect to the insulation substrate, and the inclination angle isin a range of about 50° to about 120°.
 7. The method of claim 1, whereinthe transverse and longitudinal portions of the partition overlap atleast a portion of a data line and a gate line connected to the thinfilm transistor.